|Product Name:||Dual Beam Laser Machine||Feature:||6 Axis|
|Type:||Ultrafast Laser Machine||Laser Type:||QCW Fiber Laser|
|Hole Diameter:||300μm~3000μm||Hole Accuracy:||±20μm|
laser ablation machine,
green laser cutting
6 Axis Ultrafast Laser Machine Dual Beam Laser Machine ±20μM Hole Accuracy
This machine is mainly developed for the massive batch processing of large parts in the aerospace field. It can achieve different processing such as surface texture, micro outline, and fine-micro on the large parts with complex surface of metal nonmetal, nonmetal and composite. And it is especially suitable for high-efficiency multi-hole drilling of parts with complicated curved thin surface such as aeroengine combustor.
|Laser type||QCW fiber laser|
|Depth to diameter ratio||20:1|
|Hole type||Round hole, taper hole, Inverted taper hole,|
|Stroke (X,Y,Z, U,V, C)||1000mm*750mm*1000mm*±450°*±135°*360°|
|Efficiency per single hole||1~2s for round hole, 7~15s for irregular hole|
1. Dual-beam combination of picosecond / femtosecond laser and long pulse laser , for high efficiency and high quality hole drilling;
2. The six axis servo system can be used to realize the high efficiency machining on the complex surface;
3. The UV axis can realize high flexibility positioning processing functions;
4. Automatic machining of group hole as per differentiated process parameters.
The company is mainly engaged in the R&D, production, sales and processing services of high-end laser ultra-fine micro-machining equipment. As the pioneer of domestic ultra-fast laser high-end intelligent equipment, the company's R&D team masters the core technologies of industry-leading composite beam scanning and 3D surface adaptive positioning, and has developed two generations of four types (aviation, aerospace, automotive, Electronic series) series of ultra-fast laser processing equipment, the core indicators have reached the international advanced level, providing a comprehensive solution for many difficult materials and components ultra-fine cold processing in the aerospace, aerospace and electronic information fields, has been widely used.