|Name:||Green Laser Cutting Machine||Type:||Ultrafast Laser Machine|
|Auto Type:||Semi Automatic||Processing Wide:||400mmx550mm/650mmx500mm|
laser ablation machine,
green laser cutting
Semi automatic Ultrafast Laser Machine Ultraviolet Green Laser Cutting Machine
Inorder to satisfy the high precision manufacturing requirements of various thin-plate materials, applied in consumer electronics industry PCB/FPC, cover layer profile, camera module, and fingerprint packaging chip, the machine adopts multiparameter real-time monitoring system and adaptive closed-loop control technique, such as terminal facula, beam aiming, and laser power. In this way, this machine is capable of providing solutions of simple, fast, non-consumable, contactless, high-accuracy, and arbitrarily shaped lineation, half dicing, cutting, and ablation.
|Platform positioning accuracy||≤±3μm|
|The identification accuracy||4μm/1μm|
|Optimum cutting thickness||1mm/2mm|
1 Equipped with high-performance and high accuracy scanning mirror, and high accuracy linear motor working platform;
2 CCD automatic positioning, and automatic correction software;
3 Real time feedback in software interface;
4 High-efficiency dust proofing to effectively reduce the cleaning and maintenance time of equipment.